| CPC H01G 4/30 (2013.01) [H01G 2/065 (2013.01); H01G 4/012 (2013.01); H01G 4/12 (2013.01); H01G 4/232 (2013.01)] | 8 Claims |

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1. A multi-layer ceramic electronic component, comprising:
a ceramic body having a substantially rectangular parallelepiped shape, the ceramic body including
a first main surface and a second main surface that are perpendicular to a first axis,
a pair of end surfaces perpendicular to a second axis orthogonal to the first axis,
a first side surface and a second side surface that are perpendicular to a third axis orthogonal to the first axis and the second axis,
a first corner that connects the first main surface, the first side surface, and one of the end surfaces,
a second corner that connects the second main surface, the first side surface, and the end surface,
a third corner that connects the first main surface, the second side surface, and the end surface,
a fourth corner that connects the second main surface, the second side surface, and the end surface, and
a plurality of internal electrodes laminated in a direction of the first axis or a direction of the third axis; and
a pair of external electrodes each including
a base layer that covers the end surface, and
a first conductive resin layer that includes a first side surface resin portion disposed on the first side surface to cover the first corner and having an L-shaped planar shape extending from the first corner to the direction of the first axis and a direction of the second axis, and covers at least a part of the base layer.
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