US 12,142,430 B2
Multilayer electronic component
Jinkyung Park, Suwon-si (KR); Dongjin Kim, Suwon-si (KR); Sunil Jeong, Suwon-si (KR); Suji Kang, Suwon-si (KR); and Mun Seong Jeong, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Nov. 3, 2023, as Appl. No. 18/386,962.
Application 18/386,962 is a continuation of application No. 17/398,602, filed on Aug. 10, 2021, granted, now 11,854,744.
Claims priority of application No. 10-2020-0173403 (KR), filed on Dec. 11, 2020.
Prior Publication US 2024/0062962 A1, Feb. 22, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01G 4/12 (2006.01); H01G 4/008 (2006.01); H01G 4/012 (2006.01); H01G 4/30 (2006.01)
CPC H01G 4/1218 (2013.01) [H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/30 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A multilayer electronic component comprising:
a sintered body including a dielectric layer and internal electrodes having the dielectric layer interposed therebetween in a first direction; and
external electrodes disposed on the sintered body and connected to the internal electrodes,
wherein at least one of the internal electrodes includes a dysprosium (Dy) oxide and does not include barium (Ba).