US 12,142,402 B2
Monolithic surface mount passive component
Ai-Wen Wang, Taichung (TW); Wei-Chun Shen, Taichung (TW); Yu-Mei Chen, Taichung (TW); and Guiyang Jiang, Shanghai (CN)
Assigned to Sandisk Technologies, Inc., Milpitas, CA (US)
Filed by Western Digital Technologies, Inc., San Jose, CA (US)
Filed on Jun. 10, 2021, as Appl. No. 17/344,350.
Prior Publication US 2022/0399306 A1, Dec. 15, 2022
Int. Cl. H01C 17/065 (2006.01); H01C 17/28 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2023.01); H10B 41/35 (2023.01); H10B 43/35 (2023.01)
CPC H01C 17/281 (2013.01) [H01C 17/065 (2013.01); H01L 24/01 (2013.01); H01L 24/80 (2013.01); H01L 25/0652 (2013.01); H10B 41/35 (2023.02); H10B 43/35 (2023.02); H01L 2924/1431 (2013.01); H01L 2924/1438 (2013.01); H01L 2924/19011 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19105 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A method for manufacturing a multiple passive component package, the method comprising:
performing a first printing process to print at least a portion of a first passive component and a second passive component on a first layer;
performing a second printing process to print at least a portion of a common signal terminal between the first passive component and the second passive component on the first layer,
wherein the common signal terminal provides a common connection point between the first passive component and the second passive component;
repeating the first printing process and the second printing process for a plurality of layers, wherein each of the plurality of layers is an individual ceramic sheet;
performing a stacking operation to stack the plurality of layers;
performing a pressing operation to combine the plurality of layers; and
separating one or more of the combined plurality of layers,
wherein each of the first printing process and the second printing process is a plasma assisted chemical vapor deposition process.