US 12,141,638 B2
RFID label and method of using RFID label
Haruhiko Nitta, Tokyo (JP)
Assigned to SATO HOLDINGS KABUSHIKI KAISHA, Tokyo (JP)
Appl. No. 18/041,173
Filed by SATO HOLDINGS KABUSHIKI KAISHA, Tokyo (JP)
PCT Filed Sep. 15, 2021, PCT No. PCT/JP2021/033936
§ 371(c)(1), (2) Date Feb. 9, 2023,
PCT Pub. No. WO2022/065159, PCT Pub. Date Mar. 31, 2022.
Claims priority of application No. 2020-158778 (JP), filed on Sep. 23, 2020.
Prior Publication US 2024/0028861 A1, Jan. 25, 2024
Int. Cl. G06K 19/077 (2006.01)
CPC G06K 19/07722 (2013.01) [G06K 19/0776 (2013.01)] 12 Claims
OG exemplary drawing
 
1. An RFID label comprising:
an RFID inlay comprising an inlay substrate, an RFID antenna formed on a first part of the inlay substrate, and an IC chip connected to the RFID antenna;
a label substrate laminated on a first surface of the RFID inlay via a first adhesive layer;
a shielding layer, an entirety of which is formed on a second part of the inlay substrate different from the first part, the shielding layer containing a conductive material; and
a second adhesive layer formed on the shielding layer; wherein:
the RFID antenna and the shielding layer do not overlap in a vertical direction.