US 12,141,624 B2
Stabilizing performance of processing devices
Chun Jung Hsu, Taipei (TW); and Hsih Sung Hsu, Taipei (TW)
Assigned to Hewlett-Packard Development Company, L.P., Spring, TX (US)
Appl. No. 17/059,579
Filed by Hewlett-Packard Development Company, L.P., Spring, TX (US)
PCT Filed Jan. 8, 2019, PCT No. PCT/US2019/012607
§ 371(c)(1), (2) Date Nov. 30, 2020,
PCT Pub. No. WO2020/145943, PCT Pub. Date Jul. 16, 2020.
Prior Publication US 2021/0326188 A1, Oct. 21, 2021
Int. Cl. G06F 9/50 (2006.01); G06F 1/20 (2006.01); G06F 1/3237 (2019.01); G06F 1/3296 (2019.01)
CPC G06F 9/5094 (2013.01) [G06F 1/206 (2013.01); G06F 1/3237 (2013.01); G06F 1/3296 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of stabilizing performance of a processing device, the method comprising:
determining a maximum operational temperature of any number of cores of the processing device from a thermal control circuit of the processing device;
determining a maximum thermal capacity of the processing device based on the maximum operational temperature;
setting a first maximum power limit for the processing device based on the maximum thermal capacity of the processing device and based on a standard ambient temperature associated with the processing device;
determining that a current ambient temperature associated with the processing device is lower than the standard ambient temperature;
responsive to determining that the current ambient temperature associated with the processing device is lower than the standard ambient temperature, setting a second maximum power limit for the processing device, the second maximum power limit being greater than the first maximum power limit; and
providing power to the processing device in accordance with the second maximum power limit such that the power provided to the processing device is greater than the first maximum power limit;
determining that the current ambient temperature associated with the processing device is greater than the standard ambient temperature; and
responsive to determining that the current ambient temperature associated with the processing device is greater than the standard ambient temperature, setting a third maximum power limit for the processing device, the third maximum power limit being lower than the first maximum power limit and being selected such that the processing device prevents throttling of a clock rate of the processing device.