US 12,141,005 B2
Intelligent adaptable fins for cooling datacenter devices
Xiaozhuo Cai, Shenzhen (CN); Shuanghu Yan, Shenzhen (CN); Dinghai Yi, Shenzhen (CN); Hao Zhu, Shenzhen (CN); and Yonghua Fu, Shenzhen (CN)
Assigned to Nvidia Corporation, Santa Clara, CA (US)
Appl. No. 17/606,952
Filed by Nvidia Corporation, Santa Clara, CA (US)
PCT Filed Aug. 24, 2020, PCT No. PCT/CN2020/110811
§ 371(c)(1), (2) Date Oct. 27, 2021,
PCT Pub. No. WO2022/040863, PCT Pub. Date Mar. 3, 2022.
Prior Publication US 2022/0322581 A1, Oct. 6, 2022
Int. Cl. G06F 1/20 (2006.01); H05K 7/20 (2006.01)
CPC G06F 1/206 (2013.01) [H05K 7/2039 (2013.01); H05K 7/20836 (2013.01)] 30 Claims
OG exemplary drawing
 
1. A cooling system for a datacenter device, the cooling system comprising:
a plurality of fins between a first plate and a second plate to dissipate a first amount of heat to an environment in a first configuration of the plurality of fins, the first plate movable relative to the second plate to expose a surface area of the plurality of fins to the environment in a second configuration of the plurality of fins and to dissipate a second amount of heat more than the first amount of heat, wherein at least one ribbon feature connects at least a first fin of the first plate and at least a second fin of the second plate.