US 12,140,828 B2
Semiconductor device having flexible substrate
Hsiang Yuan Cheng, Tokyo (JP)
Assigned to Japan Display Inc., Tokyo (JP)
Filed by Japan Display Inc., Tokyo (JP)
Filed on Jan. 11, 2023, as Appl. No. 18/095,569.
Application 18/095,569 is a continuation of application No. 17/077,233, filed on Oct. 22, 2020, granted, now 11,579,478.
Application 17/077,233 is a continuation of application No. 16/752,779, filed on Jan. 27, 2020, granted, now 10,816,836, issued on Oct. 27, 2020.
Application 16/752,779 is a continuation of application No. 16/182,694, filed on Nov. 7, 2018, granted, now 10,578,898, issued on Mar. 3, 2020.
Application 16/182,694 is a continuation of application No. 15/968,820, filed on May 2, 2018, granted, now 10,151,942, issued on Dec. 11, 2018.
Application 15/968,820 is a continuation of application No. 15/296,111, filed on Oct. 18, 2016, granted, now 9,989,791, issued on Jun. 5, 2018.
Claims priority of application No. 2016-034269 (JP), filed on Feb. 25, 2016.
Prior Publication US 2023/0148207 A1, May 11, 2023
Int. Cl. H01L 29/08 (2006.01); G02F 1/1333 (2006.01); G02F 1/1362 (2006.01); H10K 50/844 (2023.01); H10K 77/10 (2023.01)
CPC G02F 1/133305 (2013.01) [G02F 1/136286 (2013.01); H10K 50/844 (2023.02); H10K 77/111 (2023.02); Y02E 10/549 (2013.01)] 4 Claims
OG exemplary drawing
 
1. A semiconductor device comprising:
a flexible substrate having a first surface and a second surface opposite side of the first surface;
an active area on the first surface of the flexible substrate, the active area includes a plurality of organic diode elements;
a terminal part on the first surface of the flexible substrate;
a wiring substrate being connected to the terminal part;
a resin film covering the active area; and
a support member on the second surface of the flexible substrate, wherein
the flexible substrate includes a curved part between the active area and the terminal part,
an organic film covers the first surface of the flexible substrate at the curved part,
the resin film has an edge at the curved part side,
the organic film is in contact with the edge of the resin film at the curved part side,
the organic film does not overlap with the active area,
a first part of the support member has an edge,
the edge of the resin film is between the active area and the edge of the first part of the support member in a planar view, and
the organic firm is between the edge of the resin film and the wiring substrate in the planar view.