US 12,140,623 B2
Testing apparatus
Chih-Chieh Liao, Hsinchu (TW); Yu-Min Sun, Hsinchu (TW); and Chih-Feng Cheng, Hsinchu (TW)
Assigned to GLOBAL UNICHIP CORPORATION, Hsinchu (TW); and TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed by GLOBAL UNICHIP CORPORATION, Hsinchu (TW); and TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed on Mar. 7, 2023, as Appl. No. 18/180,101.
Claims priority of application No. 111150275 (TW), filed on Dec. 28, 2022.
Prior Publication US 2024/0219448 A1, Jul. 4, 2024
Int. Cl. G01R 31/26 (2020.01); G01R 1/067 (2006.01); G01R 1/073 (2006.01)
CPC G01R 31/2601 (2013.01) [G01R 1/06722 (2013.01); G01R 1/07314 (2013.01); G01R 1/07357 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A testing apparatus, comprising:
a circuit board comprising a plurality of contacts;
a probe station comprising a platform located on the circuit board and used for carrying a device under test (DUT), and a plurality of probe holes formed on the platform and arranged in an array; and
a probe array comprising a plurality of telescopic probes respectively linearly inserted into the plurality of probe holes, and one end of each of the plurality of telescopic probes contacted with one of the plurality of contacts, and the other end thereof contacted with one of solder balls of the DUT, wherein each of the plurality of probe holes comprises at least one elongated groove penetrating through the platform, and each of the plurality of telescopic probes is provided with at least one fin protruding outwardly therefrom and inserting into the at least one elongated groove.