CPC G01B 11/0616 (2013.01) [B25J 18/00 (2013.01)] | 14 Claims |
1. An automated system for analyzing layer thickness of a multilayer component, the automated system comprising:
a manipulator coupled to:
an opening forming device configured to create an opening having a predefined geometry partially into the multilayer component at a selected location on a surface of the multilayer component, wherein the multilayer component comprises a plurality of material layers including at least a substrate and a bond coat, and wherein the opening exposes each of the plurality of material layers; and
an imaging device configured to create an image of the exposed plurality of material layers in the opening; and
a processor configured to calculate at least a thickness of the bond coat of the exposed plurality of material layers from the image and based on the predefined geometry of the opening, wherein the plurality of material layers further includes a depletion layer extending over the bond coat; and
the processor is further configured to determine a thickness of the depletion layer, and determine a life expectancy of the bond coat based on the at least one of the thickness of the depletion layer and the thickness of the bond coat.
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