US 12,140,386 B2
Heat-dissipating substrate structure
Ching-Ming Yang, New Taipei (TW); and Tze-Yang Yeh, New Taipei (TW)
Assigned to AMULAIRE THERMAL TECHNOLOGY, INC., New Taipei (TW)
Filed by AMULAIRE THERMAL TECHNOLOGY, INC., New Taipei (TW)
Filed on Sep. 6, 2022, as Appl. No. 17/903,993.
Application 17/903,993 is a continuation in part of application No. 17/368,836, filed on Jul. 7, 2021, abandoned.
Prior Publication US 2023/0009424 A1, Jan. 12, 2023
Int. Cl. F28F 21/08 (2006.01); B32B 15/01 (2006.01); F28F 3/12 (2006.01)
CPC F28F 21/089 (2013.01) [B32B 15/017 (2013.01); F28F 3/12 (2013.01); F28F 21/084 (2013.01); B32B 2307/72 (2013.01); B32B 2307/732 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A heat-dissipating substrate structure, comprising:
a base layer made of a metal; and
a cold spray coating layer formed on a top surface of the base layer; wherein the cold spray coating layer is a film formed on the top surface of the base layer by spraying a solid-phase metal powder and a high-pressure compressed gas with a pressure of 4 to 6 Mpa onto the base layer; wherein the solid-phase metal powder at least includes a film-forming powder with an apparent density of 3 to 4 g/cm3 and a median particle diameter (D50) of 30 μm or less; wherein a maximum depth of a bottom of the cold spray coating layer embedded in the base layer is less than 60 μm; wherein at least one internal cooling fin is joined to a bottom surface of the base layer, and at least one internal coolant passage is defined between the base layer and the at least one internal cooling fin.