US 12,140,304 B2
Phosphor element with heat dissipating substrate that has thermally conductive metal plating film
Jungo Kondo, Miyoshi (JP); Keiichiro Asai, Nagoya (JP); and Naotake Okada, Anjo (JP)
Assigned to NGK INSULATORS, LTD., Nagoya (JP)
Filed by NGK INSULATORS, LTD., Nagoya (JP)
Filed on Feb. 26, 2021, as Appl. No. 17/186,578.
Application 17/186,578 is a continuation of application No. PCT/JP2018/031687, filed on Aug. 28, 2018.
Prior Publication US 2021/0184425 A1, Jun. 17, 2021
Int. Cl. F21V 9/30 (2018.01); F21V 29/502 (2015.01); F21V 29/89 (2015.01); F21Y 115/30 (2016.01); H01S 5/00 (2006.01)
CPC F21V 9/30 (2018.02) [F21V 29/502 (2015.01); F21V 29/89 (2015.01); F21Y 2115/30 (2016.08); H01S 5/0087 (2021.01)] 8 Claims
OG exemplary drawing
 
1. A phosphor element comprising:
a phosphor part including an incident face of an excitation light, an opposing face opposing said incident face, and a side face, said phosphor part converting at least a part of said excitation light incident onto said incident face to a fluorescence and emitting said fluorescence from said opposing face or said incident face,
a heat dissipating substrate directly or indirectly provided over said side face of said phosphor part, said heat dissipating substrate comprises a metal plating film comprising a metal having a thermal conductivity of 200 W/mK or higher,
wherein said heat dissipating substrate comprises a main face on a side of said incident face and a main face on a side of said opposing face, and
wherein an angle of said incident face and of a direction of growth of said metal plating film on a main face on said side of said opposing face or a main face on said side of said incident face of said heat dissipating substrate is 60° to 120°.