CPC F04D 29/582 (2013.01) [F04D 29/281 (2013.01); F04D 29/4226 (2013.01)] | 8 Claims |
1. A heat dissipation system of an electronic device, comprising: a body; a plurality of heat sources disposed in the body; at least one centrifugal heat dissipation fan disposed in the body and comprising: a housing having at least one inlet disposed along an axis and a plurality of outlets in different radial directions, wherein the plurality of outlets respectively correspond to the plurality of heat sources; and an impeller disposed in the housing along the axis;
wherein the plurality of heat sources comprise at least one electronic chip, at least one heat conduction element, and at least one heat dissipation fin, the at least one electronic chip transfers heat to the at least one heat dissipation fin through the at least one heat conduction element, and the plurality of outlets respectively correspond to the at least one electronic chip, the at least one heat conduction element, or the at least one heat dissipation fin; and
wherein the at least one electronic chip is disposed in the body, the at least one heat dissipation fin is disposed at an edge inside the body, some of the plurality of outlets face inward of the body to correspond to the at least one electronic chip, and others of the plurality of outlets face outward of the body to correspond to the at least one heat dissipation fin.
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