US 12,139,963 B2
Method for manufacturing glass panel unit, and glass panel unit assembly
Tasuku Ishibashi, Ishikawa (JP); Eiichi Uriu, Osaka (JP); Kazuya Hasegawa, Osaka (JP); Hiroyuki Abe, Osaka (JP); Masataka Nonaka, Osaka (JP); and Takeshi Shimizu, Osaka (JP)
Assigned to Panasonic Intellectual Property Management Co., Ltd., Osaka (JP)
Appl. No. 17/602,342
Filed by Panasonic Intellectual Property Management Co., Ltd., Osaka (JP)
PCT Filed Mar. 19, 2020, PCT No. PCT/JP2020/012475
§ 371(c)(1), (2) Date Oct. 8, 2021,
PCT Pub. No. WO2020/209033, PCT Pub. Date Oct. 15, 2020.
Claims priority of application No. 2019-076001 (JP), filed on Apr. 12, 2019.
Prior Publication US 2022/0162903 A1, May 26, 2022
Int. Cl. E06B 3/677 (2006.01); E06B 3/66 (2006.01); E06B 3/663 (2006.01)
CPC E06B 3/677 (2013.01) [E06B 3/6612 (2013.01); E06B 3/66342 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A method for manufacturing a glass panel unit, the method comprising an assembling step, a bonding step, a gas exhausting step, and a sealing step,
the assembling step including providing an assembly,
the assembly including:
a first glass pane;
a second glass pane arranged to face the first glass pane;
a peripheral wall having a frame shape and provided between the first glass pane and the second glass pane;
an internal space surrounded with the first glass pane, the second glass pane, and the peripheral wall;
a partition to partition the internal space into a first space and a second space;
an exhaust port allowing the second space to communicate with an external environment; and
an air passage allowing the first space to communicate with the second space,
at least one of the first glass pane or the second glass pane including a low-emissivity film,
the low-emissivity film being provided in the first space,
the bonding step including melting the peripheral wall to hermetically bond the first glass pane and the second glass pane together with the peripheral wall,
the gas exhausting step including exhausting a gas from the first space through the air passage, the second space, and the exhaust port,
the sealing step including deforming the partition at a temperature equal to or higher than a softening point of the partition to close the air passage,
a ratio of an emission quantity of a rare gas emitted, in a situation where the low-emissivity film is heated at a temperature increase rate of 4° C./min before the peripheral wall is melted, from the low-emissivity film at a deformation temperature of the partition to an emission quantity of the rare gas emitted from the low-emissivity film at 100° C. being equal to or less than 2.0.