US 12,139,810 B2
Localized electrochemical deposition
Antony Aguilar, Scottsdale, AZ (US)
Assigned to Arizona Board of Regents on Behalf of Arizona State University, Scottsdale, AZ (US)
Filed by Antony Aguilar, Scottsdale, AZ (US)
Filed on Jun. 15, 2021, as Appl. No. 17/348,423.
Claims priority of provisional application 63/039,244, filed on Jun. 15, 2020.
Prior Publication US 2021/0388521 A1, Dec. 16, 2021
Int. Cl. C25D 17/12 (2006.01); C25D 5/02 (2006.01); C25D 5/04 (2006.01); C25D 5/18 (2006.01); H01L 31/0224 (2006.01)
CPC C25D 5/02 (2013.01) [C25D 5/04 (2013.01); C25D 5/18 (2013.01); C25D 17/12 (2013.01); H01L 31/022425 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A localized electrochemical deposition (LECD) device, comprising:
a chemical bath;
a cathode comprising a deposition surface in contact with the chemical bath;
a deposition anode configured to cause a patterned electrochemical deposition on the deposition surface without masking the deposition surface, wherein the deposition anode comprises:
a bulk metal, wherein the bulk metal is formed from a first material that is reactive to the chemical bath; and
an inert metal layer formed over the bulk metal, wherein the inert metal layer is formed from a second material which is non-reactive to the chemical bath;
a mask on the inert metal layer such that the mask covers the inert metal layer and such that the inert metal layer is vertically between the mask and the bulk metal, wherein the deposition anode and the mask are separate and displaced from the cathode;
a source material that is reactive to the chemical bath for electroplating the deposition surface; and
a voltage source connected to the cathode and the deposition anode.