| CPC C23C 16/45565 (2013.01) [H01J 37/32449 (2013.01); C23C 2/003 (2013.01); C23C 16/4558 (2013.01); H01J 37/3244 (2013.01); H01L 21/02002 (2013.01); H01L 21/02104 (2013.01)] | 19 Claims |

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1. An apparatus comprising:
a showerhead faceplate having a plurality of gas distribution passages extending from a first side of the showerhead faceplate to a second side of the showerhead faceplate opposite the first side, wherein:
the first side and the second side define an average midplane of the showerhead faceplate,
the second side of the showerhead faceplate is configured to face towards a wafer support located within a semiconductor processing chamber and to be exposed to plasma,
the gas distribution passages in a first subset of gas distribution passages of the plurality of gas distribution passages extend at least partially along axes that are at a first oblique angle to a center axis perpendicular to the average midplane of the showerhead faceplate,
the gas distribution passages in a second subset of gas distribution passages of the plurality of gas distribution passages extend along directions parallel to the center axis and are arranged in an outermost circular pattern of gas distribution passages,
the gas distribution passages in the first subset of gas distribution passages are arranged in a first circular pattern of gas distribution passages that is smaller than the outermost circular pattern of gas distribution passages and contained within the outermost circular pattern of gas distribution passages, and
each gas distribution passage in the first subset of gas distribution passages intersects the first side of the showerhead faceplate at a location closer to the center axis than a location at which that gas distribution passage intersects the second side of the showerhead faceplate.
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