US 12,139,568 B2
High temperature, conductive thermosetting resin compositions
Stanley Shengqian Kong, Hillsborough, NJ (US)
Assigned to TCLAD INC., Prescott, WI (US)
Appl. No. 17/418,735
Filed by TCLAD INC., Prescott, WI (US)
PCT Filed Dec. 30, 2019, PCT No. PCT/US2019/068880
§ 371(c)(1), (2) Date Jun. 25, 2021,
PCT Pub. No. WO2020/140109, PCT Pub. Date Jul. 2, 2020.
Claims priority of provisional application 62/785,940, filed on Dec. 28, 2018.
Prior Publication US 2022/0064352 A1, Mar. 3, 2022
Int. Cl. C08F 236/14 (2006.01); C08K 3/22 (2006.01); C08L 47/00 (2006.01); C09K 5/14 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01)
CPC C08F 236/14 (2013.01) [C08K 3/22 (2013.01); C08L 47/00 (2013.01); C09K 5/14 (2013.01); H05K 1/0373 (2013.01); H05K 1/09 (2013.01); C08K 2003/2227 (2013.01); C08K 2201/001 (2013.01)] 12 Claims
 
1. A composition comprising:
(a) A resin comprising:
(i) a first compound having one or more functional groups selected from maleimides, nadimides or itaconimides;
(ii) an aromatic compound functionalized with one or more ether group(s) and one or more allyl group(s); and
(iii) an ethynyl aryl compound;
(b) a thermally conductive filler in an amount of about 0.01 to about 20 weight equivalents of the total resin; and
(c) a solvent selected from cycloalkanones, dialkyl formamides, dialkyl acetamides, and combinations thereof.