US 12,138,928 B2
Method for manufacturing liquid ejection head substrate and method for manufacturing liquid ejection head
Seiko Minami, Saitama (JP); Hidenori Yamato, Tokyo (JP); Takaaki Yamaguchi, Kanagawa (JP); Nobuyuki Hirayama, Kanagawa (JP); Kyohei Kubota, Oita (JP); and Yu Nishimura, Oita (JP)
Assigned to CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed by CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed on Aug. 12, 2022, as Appl. No. 17/886,646.
Claims priority of application No. 2021-131994 (JP), filed on Aug. 13, 2021.
Prior Publication US 2023/0049764 A1, Feb. 16, 2023
Int. Cl. G03F 7/20 (2006.01); B41J 2/16 (2006.01)
CPC B41J 2/1631 (2013.01) [B41J 2/1601 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A method for manufacturing a liquid ejection head substrate, the method comprising:
forming a split pattern on a substrate by performing exposure in a split manner through a mask pattern;
forming a single-shot pattern on the substrate by performing exposure in a single-shot manner through a mask pattern; and
setting a first part and a second part to the substrate, the first part being required to have higher positional precision than the second pattern, the second part being required to have higher fabrication precision than the first part, wherein
for the first part, the single-shot pattern is formed by the forming a single-shot pattern, and
for the second part, the split pattern is formed by the forming a split pattern.