US 12,138,747 B2
Planarization process, apparatus and method of manufacturing an article
Byung-Jin Choi, Austin, TX (US); Ozkan Ozturk, Round Rock, TX (US); Masaki Saito, Austin, TX (US); and Seth J. Bamesberger, Austin, TX (US)
Assigned to CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed by CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed on May 19, 2022, as Appl. No. 17/748,859.
Prior Publication US 2023/0373065 A1, Nov. 23, 2023
Int. Cl. B25B 11/00 (2006.01); B23B 31/30 (2006.01)
CPC B25B 11/005 (2013.01) [B23B 31/307 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A planarization apparatus, comprising:
a superstrate chuck, comprising:
one or more inner lands protruding from a surface of the superstrate chuck; and
a peripheral land protruding from the surface of the superstrate chuck along a periphery of the superstrate chuck and encircling the inner lands therein, wherein:
the peripheral land has a height smaller than a height of each of the inner lands; and
the peripheral land has a width larger than a width of each of the inner lands,
wherein a surface of the peripheral land distal to the surface of the superstrate chuck has a multi-step structure, and
wherein the peripheral land includes a highest step at an outer edge and a lowest step between the outer edge and an inner edge of the peripheral land.