US 12,138,743 B2
Polishing device
Yong Kang, Xi'an (CN)
Assigned to XI'AN ESWIN MATERIAL TECHNOLOGY CO., LTD., Xi'an (CN); and XI'AN ESWIN SILICON WAFER TECHNOLOGY CO., LTD., Xi'an (CN)
Filed by XI'AN ESWIN MATERIAL TECHNOLOGY CO., LTD., Xi'an (CN); and XI'AN ESWIN SILICON WAFER TECHNOLOGY CO., LTD., Xi'an (CN)
Filed on Jul. 1, 2020, as Appl. No. 16/918,617.
Claims priority of application No. 201910887203.X (CN), filed on Sep. 19, 2019.
Prior Publication US 2021/0086323 A1, Mar. 25, 2021
Int. Cl. B24B 9/06 (2006.01); B24B 41/04 (2006.01); B24B 41/06 (2012.01)
CPC B24B 9/065 (2013.01) [B24B 41/04 (2013.01); B24B 41/06 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A polishing device, comprising:
a bearing mechanism comprising a bearing plate configured to carry a wafer and drive the wafer to rotate; and
a first polishing mechanism comprising at least one group of rotatable first polishing wheels, wherein each of the first polishing wheels is formed with a first polishing groove extending along a circumferential direction, each of the at least one group of rotatable first polishing wheels comprises two identical first polishing wheels which are formed with identical first polishing grooves extending along the circumferential direction, the two identical first polishing wheels in each group are arranged symmetrically with respect to the bearing plate and rotation axes of the two identical first polishing wheels are coplanar with a rotation axis of the bearing plate, and the two identical first polishing wheels in each group are capable of simultaneously moving close to or away from the wafer so that an inner sidewall of each first polishing groove is simultaneously pressed against or moves away from the wafers,
wherein the first polishing mechanism further comprises at least one group of first motors and each of the at least one group of first motors comprises two first motors, and the two identical first polishing wheels in each group of rotatable first polishing wheels are respectively connected to the two first motors in each group of first motors to allow the first motors to drive the two identical first polishing wheels to rotate,
the polishing device further comprising at least one group of first driving mechanisms, and the first driving mechanisms in each group of the first driving mechanisms are connected to the two first motors in each group of first motors respectively to simultaneously drive the two identical first polishing wheels toward or away from the wafer, and
wherein each group of the first driving mechanisms comprises:
two first racks arranged in parallel orientation with each of the other first rack, wherein the two first motors in each group of first motors are arranged on the first racks respectively;
a first gear arranged between the two first racks and engaging with the two first racks, wherein the first gear drives the two first racks to move the two identical first polishing wheels towards or away from the wafer when the first gear rotates; and
a first driving part connected to the first gear to drive the first gear to rotate.