US 12,138,734 B2
Substrate polishing apparatus and polishing liquid discharge method in substrate polishing apparatus
Tetsuji Togawa, Tokyo (JP); and Kenichi Kobayashi, Tokyo (JP)
Assigned to EBARA CORPORATION, Tokyo (JP)
Filed by Ebara Corporation, Tokyo (JP)
Filed on Apr. 7, 2023, as Appl. No. 18/297,469.
Application 18/297,469 is a division of application No. 16/638,711, granted, now 11,648,638, previously published as PCT/JP2018/030613, filed on Aug. 20, 2018.
Claims priority of application No. 2017-158473 (JP), filed on Aug. 21, 2017.
Prior Publication US 2023/0302604 A1, Sep. 28, 2023
Int. Cl. B24B 37/04 (2012.01); B24B 57/02 (2006.01); H01L 21/306 (2006.01)
CPC B24B 37/042 (2013.01) [B24B 57/02 (2013.01); H01L 21/30625 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A polishing liquid discharge method in a substrate polishing apparatus, comprising:
a step of preparing a rotary table that includes a cylinder and a piston and has a surface to which an opening portion is provided for discharging a polishing liquid;
a step of communicating with a liquid holding space and filling the polishing liquid in the liquid holding space from the opening portion, the liquid holding space being defined by the cylinder and the piston; and
a step of discharging the polishing liquid from the opening portion by driving the piston to press the polishing liquid filled in the liquid holding space.