US 12,138,710 B2
Laser processing apparatus and method of manufacturing semiconductor device
Yuki Suzuki, Yokohama (JP); Yoshihiro Yamaguchi, Yokohama (JP); Takahiro Fuji, Yokohama (JP); and Takahiro Mikami, Yokohama (JP)
Assigned to JSW AKTINA SYSTEM CO., LTD, Yokohama (JP)
Appl. No. 16/975,117
Filed by JSW AKTINA SYSTEM CO., LTD., Yokohama (JP)
PCT Filed Mar. 25, 2019, PCT No. PCT/JP2019/012598
§ 371(c)(1), (2) Date Aug. 22, 2020,
PCT Pub. No. WO2019/202923, PCT Pub. Date Oct. 24, 2019.
Claims priority of application No. 2018-080321 (JP), filed on Apr. 19, 2018.
Prior Publication US 2021/0362273 A1, Nov. 25, 2021
Int. Cl. B23K 26/352 (2014.01); B23K 101/40 (2006.01); H01L 21/268 (2006.01); H01L 27/12 (2006.01)
CPC B23K 26/352 (2015.10) [H01L 21/268 (2013.01); B23K 2101/40 (2018.08); H01L 27/1274 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A laser processing apparatus comprising:
a laser light irradiation unit; and
a conveying stage capable of allowing a substrate to float and convey, wherein
the conveying stage includes:
a laser light irradiation region in which the substrate is irradiated with laser light irradiated from the laser light irradiation unit; and
a substrate conveying region separated from the laser light irradiation region,
a surface of the laser light irradiation region facing the substrate is configured by a first member from which a first gas is capable of jetting out to float the substrate,
a surface of the substrate conveying region facing the substrate is configured by a plurality of second members from which a second gas is capable of jetting out to float the substrate, and
the plurality of second members in the substrate conveying region are disposed to be separated from each other,
the first member includes:
a first region;
a second region adjacent to the first region; and
a third region adjacent to the second region,
the third region overlaps a focus of the laser light in a plan view,
the second region is between the first region and the third region,
the first and second regions do not overlap the focus of the laser light in the plan view,
control accuracy of a floating height of the substrate in the second region is higher than control accuracy of a floating height of the substrate in the first region, and
control accuracy of a floating height of the substrate in the third region is higher than the control accuracy of the floating height of the substrate in the second region.