US 12,138,707 B2
Arrangement for making a diffusion solder connection between an electrically conductive contact element and a workpiece
Rudi Blumenschein, Woert (DE); Frank Kaehny, Bensheim (DE); and Manuel Eheim, Bensheim (DE)
Assigned to TE Connectivity Germany GmbH, Bensheim (DE)
Filed by TE Connectivity Germany GmbH, Bensheim (DE)
Filed on Mar. 15, 2022, as Appl. No. 17/695,448.
Claims priority of application No. 102021106393.0 (DE), filed on Mar. 16, 2021.
Prior Publication US 2022/0297226 A1, Sep. 22, 2022
Int. Cl. B23K 20/00 (2006.01); B23K 20/02 (2006.01); B23K 20/26 (2006.01)
CPC B23K 20/026 (2013.01) [B23K 20/26 (2013.01)] 16 Claims
OG exemplary drawing
 
1. An arrangement for making a diffusion solder connection between an electrically conductive contact element and a workpiece, comprising:
a protective chamber having a workpiece position at which at least a portion of the workpiece is arranged;
an acceleration device shooting the electrically conductive contact element into the workpiece arranged at the workpiece position; and
a projectile, the electrically conductive contact element forms at least a sub-portion of the projectile.