US 12,138,670 B2
Substrate treating apparatus and substrate treating method
Junyoung Choi, Cheongju-si (KR); and Jong Doo Lee, Gyeongju-si (KR)
Assigned to SEMES CO., LTD., Cheonan-si (KR)
Filed by SEMES CO., LTD., Cheonan-si (KR)
Filed on Jul. 7, 2021, as Appl. No. 17/369,892.
Claims priority of application No. 10-2020-0084279 (KR), filed on Jul. 8, 2020.
Prior Publication US 2022/0008964 A1, Jan. 13, 2022
Int. Cl. B08B 7/00 (2006.01); B01D 11/02 (2006.01); B08B 9/032 (2006.01); C23G 5/04 (2006.01); F26B 3/02 (2006.01); H01L 21/02 (2006.01); H01L 21/67 (2006.01)
CPC B08B 7/0021 (2013.01) [B01D 11/0203 (2013.01); B08B 9/0321 (2013.01); C23G 5/04 (2013.01); F26B 3/02 (2013.01); H01L 21/02101 (2013.01); H01L 21/67017 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A substrate treating apparatus comprising:
a process chamber configured to provide a treatment space, in which a substrate is treated, in an interior thereof;
a fluid supply unit configured to supply a fluid into the process chamber;
an exhaust unit including an exhaust line, through which the fluid in the process chamber is exhausted;
wherein the fluid supply unit includes:
a supply tank, in which the fluid is stored;
a supply line connecting the supply tank and the process chamber;
a branch line branched from the supply line at a first point of the supply line; and
a sensor configured to measure a temperature of the fluid around the first point; and
a controller configured to control the fluid supply unit, and
wherein the controller controls the fluid supply unit such that the fluid is drained from the supply line through the branch line shortly before the fluid is supplied into the process chamber,
wherein the controller controls the fluid supply unit such that the fluid is drained through the branch line until the fluid in the supply line reaches the a stabilized state shortly before the fluid is supplied into the process chamber, and
wherein the stabilized state is a state, in which the temperature of the fluid around the first point reaches a process temperature, at which the substrate is treated in the process chamber.