US 12,138,666 B2
Substrate processing method and substrate processing apparatus
Toru Endo, Kyoto (JP); Yuta Yamanouchi, Kyoto (JP); Yuta Segawa, Kyoto (JP); Rikuta Aoki, Kyoto (JP); Tsung Ju Lin, Kyoto (JP); and Jun Sawashima, Kyoto (JP)
Assigned to SCREEN Holdings Co., Ltd., (JP)
Filed by SCREEN Holdings Co., Ltd., Kyoto (JP)
Filed on Feb. 9, 2023, as Appl. No. 18/166,603.
Claims priority of application No. 2022-020586 (JP), filed on Feb. 14, 2022; and application No. 2022-160808 (JP), filed on Oct. 5, 2022.
Prior Publication US 2023/0256477 A1, Aug. 17, 2023
Int. Cl. B08B 3/04 (2006.01); B08B 3/02 (2006.01); B08B 13/00 (2006.01)
CPC B08B 3/04 (2013.01) [B08B 3/024 (2013.01); B08B 13/00 (2013.01); B08B 2203/0264 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A substrate processing apparatus comprising:
a substrate holding unit that holds a substrate horizontally;
a chemical liquid nozzle that includes a chemical liquid discharge port that discharges a chemical liquid in a chemical liquid discharge direction, inclined with respect to an upper surface of the substrate held by the substrate holding unit, toward a target position on the upper surface of the substrate;
a spray shield that includes a shield surface directly opposing the upper surface of the substrate and with which the shield surface overlaps with the target position in plan view and, when the chemical liquid nozzle and the shield surface are viewed from below, all portions of the chemical liquid discharge port are disposed at an outer side of an outer edge of the shield surface or on the outer edge of the shield surface; the shield surface is not in contact with the chemical liquid on the substrate; and
a nozzle moving unit that moves the chemical liquid nozzle together with the spray shield, wherein
at least a portion of the shield surface is disposed higher than an upper end of the chemical liquid discharge port.