| CPC H10N 50/01 (2023.02) [G11C 11/161 (2013.01); H10B 61/00 (2023.02); H10N 50/80 (2023.02); G11C 11/1675 (2013.01)] | 14 Claims |

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1. A semiconductor device comprising:
a magnetic tunnel junction (MTJ) stack;
a first metal line above the MTJ stack, wherein the first metal line is connected physically and electrically to a top electrode of the MTJ stack; and
a magnetoelectric material layer above the first metal line.
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