US 12,471,484 B2
Display panel and manufacturing method thereof
Feng Wei, Shenzhen (CN); and Jinchuan Li, Shenzhen (CN)
Assigned to SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD., Shezhen (CN)
Appl. No. 16/625,778
Filed by SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD., Shenzhen (CN)
PCT Filed Dec. 13, 2019, PCT No. PCT/CN2019/125159
§ 371(c)(1), (2) Date Jun. 15, 2022,
PCT Pub. No. WO2021/109210, PCT Pub. Date Jun. 10, 2021.
Claims priority of application No. 201911224528.6 (CN), filed on Dec. 4, 2019.
Prior Publication US 2022/0310739 A1, Sep. 29, 2022
Int. Cl. H10K 71/40 (2023.01); H10K 50/84 (2023.01); H10K 50/842 (2023.01); H10K 59/131 (2023.01); H10K 59/80 (2023.01); H10K 71/00 (2023.01)
CPC H10K 59/874 (2023.02) [H10K 50/8426 (2023.02); H10K 50/846 (2023.02); H10K 59/131 (2023.02); H10K 59/8722 (2023.02); H10K 59/873 (2023.02); H10K 71/00 (2023.02); H10K 71/40 (2023.02)] 16 Claims
OG exemplary drawing
 
1. A display panel, comprising:
a substrate;
a light-emitting functional layer disposed on the substrate;
a thin-film encapsulation layer disposed on the substrate to cover the light-emitting functional layer;
a drying layer disposed on the substrate to surround the thin-film encapsulation layer;
an encapsulation cover plate disposed on the drying layer and the thin-film encapsulation layer;
a curing adhesive layer disposed between the substrate and the encapsulation cover plate to fix the substrate and the encapsulation cover plate, wherein the curing adhesive layer is disposed to surround the drying layer and an orthographic projection of the curing adhesive layer on the substrate is spaced apart from an orthographic projection of the drying layer on the substrate, so that a ring-shaped groove is formed between the drying layer and the curing adhesive layer; and
an encapsulation adhesive layer disposed in the ring-shaped groove,
wherein the curing adhesive layer comprises an ultraviolet curing adhesive, and the encapsulation adhesive layer comprises an adhesive different from the ultraviolet curing adhesive.