| CPC H10K 59/121 (2023.02) [H10D 86/0221 (2025.01); H10D 86/441 (2025.01); H10D 86/60 (2025.01); H10K 59/131 (2023.02); H10K 59/82 (2023.02)] | 17 Claims |

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1. A semi-transparent display comprising:
a residual assembly comprising a silicon on insulator (“SOI”) wafer with a pixel region and a contact region situated next to the pixel region, wherein the SOI wafer is missing a silicon substrate removed from a rear side of the SOI wafer;
an electromagnetic radiation emitting layer deposited on a front side of the SOI wafer;
a transparent cover layer applied above the electromagnetic radiation emitting layer;
a wiring carrier attached to a rear side of the residual assembly, wherein the wiring carrier comprises a printed circuit board having a recess at least in the pixel region; and
a plurality of electrically conductive connections arranged between the contact region of the SOI wafer and the wiring carrier from the rear side of the SOI wafer and include a bump bond or an anisotropically conducting bond;
wherein the pixel region includes a plurality of subsections in which no circuit elements and no electrically conductive elements are situated, further wherein the subsections are permitting light detectable with a human eye to pass from a front side of the semi-transparent display to a rear side of the semi-transparent display.
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