US 12,471,440 B2
Display device, method for fabricating display device, and electronic instrument
Tomoyoshi Ichikawa, Kanagawa (JP)
Assigned to Sony Semiconductor Solutions Corporation, Kanagawa (JP)
Appl. No. 17/996,551
Filed by Sony Semiconductor Solutions Corporation, Kanagawa (JP)
PCT Filed Apr. 27, 2021, PCT No. PCT/JP2021/016810
§ 371(c)(1), (2) Date Oct. 19, 2022,
PCT Pub. No. WO2021/225096, PCT Pub. Date Nov. 11, 2021.
Claims priority of application No. 2020-081724 (JP), filed on May 7, 2020.
Prior Publication US 2023/0217737 A1, Jul. 6, 2023
Int. Cl. H10K 50/852 (2023.01); H10K 59/12 (2023.01); H10K 59/127 (2023.01); H10K 59/131 (2023.01); H10K 59/35 (2023.01); H10K 59/80 (2023.01)
CPC H10K 50/852 (2023.02) [H10K 59/12 (2023.02); H10K 59/1201 (2023.02); H10K 59/1275 (2023.02); H10K 59/131 (2023.02); H10K 59/35 (2023.02); H10K 59/876 (2023.02); H10K 59/879 (2023.02)] 20 Claims
OG exemplary drawing
 
1. A display device comprising:
pixels arranged in a two-dimensional matrix, each of the pixels including a light emitting element formed by stacking an upper electrode, a light emitting unit, and a lower electrode, wherein
the light emitting elements are formed by forming the upper electrodes which are light-transmissive, and then sequentially stacking, onto the upper electrodes, the light emitting units and the lower electrode which is formed from a metal material,
the light emitting units are formed from an organic layer including a light emitting layer or are formed from a micrometer-sized LED element,
a joining surface of a lower substrate in which a drive circuit that drives the light emitting elements is formed is joined to a joining surface that an upper substrate in which the light emitting elements are formed has on a lower-electrode side,
the upper substrate includes first connection parts disposed on the joining surface on the lower-electrode side so as to correspond to the respective light emitting elements,
the lower substrate includes second connection parts disposed on the joining surface of the lower substrate so as to correspond to the first connection parts,
the upper electrodes are formed individually to correspond to the respective light emitting elements,
the lower electrode is formed as an electrode shared by each of the light emitting elements, and
the upper electrodes and the first connection parts are connected via contact plugs passing through openings provided in the lower electrode.