US 12,471,424 B2
Array substrate and manufacturing method therefor, display panel, and backlight module
Ke Wang, Beijing (CN); Zhanfeng Cao, Beijing (CN); Xinhong Lu, Beijing (CN); Qi Qi, Beijing (CN); Yan Qu, Beijing (CN); Zhiwei Liang, Beijing (CN); Yingwei Liu, Beijing (CN); Dapeng Xue, Beijing (CN); Guoqiang Wang, Beijing (CN); Jianguo Wang, Beijing (CN); Song Liu, Beijing (CN); Yongfei Li, Beijing (CN); Ting Zeng, Beijing (CN); Huan Liu, Beijing (CN); Wanru Dong, Beijing (CN); Heren Gui, Beijing (CN); Jian Yang, Beijing (CN); Haifeng Hu, Beijing (CN); Yu Jiang, Beijing (CN); Peng Xu, Beijing (CN); Weiwei Chu, Beijing (CN); and Qi Gao, Beijing (CN)
Assigned to BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD., Beijing (CN)
Appl. No. 17/790,308
Filed by BOE TECHNOLOGY GROUP CO., LTD., Beijing (CN)
PCT Filed Aug. 31, 2021, PCT No. PCT/CN2021/115688
§ 371(c)(1), (2) Date Jun. 30, 2022,
PCT Pub. No. WO2022/048538, PCT Pub. Date Mar. 10, 2022.
Claims priority of application No. 202010927576.8 (CN), filed on Sep. 7, 2020; application No. 202010927603.1 (CN), filed on Sep. 7, 2020; and application No. 202010947439.0 (CN), filed on Sep. 10, 2020.
Prior Publication US 2023/0043951 A1, Feb. 9, 2023
Int. Cl. H10H 20/857 (2025.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 25/075 (2006.01); H10H 20/01 (2025.01)
CPC H10H 20/857 (2025.01) [H01L 21/4846 (2013.01); H01L 23/49838 (2013.01); H01L 23/49866 (2013.01); H01L 25/0753 (2013.01); H01L 24/16 (2013.01); H01L 2224/16237 (2013.01); H01L 2924/12041 (2013.01); H10H 20/0364 (2025.01)] 26 Claims
OG exemplary drawing
 
1. An array substrate, comprising:
a base substrate;
a metal wiring layer provided at a side of the base substrate;
a first planarization layer provided at a side of the metal wiring layer away from the base substrate;
an electrode layer provided at a side of the first planarization layer away from the base substrate; the electrode layer comprising a metal sub-layer and a conductive sub-layer sequentially stacked at the side of the base substrate; material of the metal sub-layer comprising metal or metal alloy; the conductive sub-layer having oxidation resistance and covering the metal sub-layer;
a second planarization layer provided at a side of the electrode layer away from the base substrate;
a functional device layer provided at a side of the second planarization layer away from the base substrate, and comprising a plurality of functional devices electrically connected to the electrode layer;
wherein the array substrate further comprises an inorganic protective layer sandwiched between the electrode layer and the second planarization layer.