US 12,471,422 B2
Optoelectronic device and method for producing an optoelectronic device
Hermann Nuss, Regensburg (DE); Andreas Dobner, Wenzenbach (DE); Bjoern Hoxhold, Sinzing Viehhausen (DE); Andreas Waldschik, Wolmirstedt (DE); Erwin Beer, Pielenhofen (DE); Bernd Boehm, Obertraubling (DE); Ludwig Hofbauer, Regenstauf (DE); Stefan Merl, Schwandorf (DE); Stefan Rass, Regensburg (DE); and Matthias Stark, Bad Abbach (DE)
Assigned to OSRAM Opto Semiconductors GmbH, Regensburg (DE)
Appl. No. 17/782,545
Filed by OSRAM Opto Semiconductors GmbH, Regensburg (DE)
PCT Filed Nov. 30, 2020, PCT No. PCT/EP2020/083871
§ 371(c)(1), (2) Date Jun. 3, 2022,
PCT Pub. No. WO2021/110580, PCT Pub. Date Jun. 10, 2021.
Claims priority of application No. 102019219016.2 (DE), filed on Dec. 5, 2019.
Prior Publication US 2023/0006118 A1, Jan. 5, 2023
Int. Cl. H10H 20/857 (2025.01); H01L 25/075 (2006.01); H10H 20/01 (2025.01)
CPC H10H 20/857 (2025.01) [H01L 25/0753 (2013.01); H10H 20/01 (2025.01); H10H 20/0364 (2025.01)] 19 Claims
OG exemplary drawing
 
1. An optoelectronic device comprising:
a carrier; and
a plurality of semiconductor chips fastened on the carrier by a connector,
wherein each semiconductor chip has at least one contact pad on a main surface facing away from the carrier,
wherein each semiconductor chip comprises an active region configured to generate radiation, the active region spaced apart from the main surface,
wherein each contact pad is electrically contacted by an interconnecting track, and
wherein the interconnecting track is guided directly over an edge of the main surface of the semiconductor chip onto the carrier.