US 12,471,420 B2
Light emitting device
Hiroaki Ukawa, Itano-gun (JP); and Ryo Iwasa, Anan (JP)
Assigned to NICHIA CORPORATION, Anan (JP)
Filed by NICHIA CORPORATION, Anan (JP)
Filed on Jul. 14, 2021, as Appl. No. 17/375,466.
Application 17/375,466 is a continuation of application No. 16/365,334, filed on Mar. 26, 2019, granted, now 11,094,864.
Claims priority of application No. 2018-060304 (JP), filed on Mar. 27, 2018.
Prior Publication US 2021/0343917 A1, Nov. 4, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. H10H 20/857 (2025.01); H10H 20/85 (2025.01); H10H 20/851 (2025.01); H10H 20/853 (2025.01); H10H 20/856 (2025.01)
CPC H10H 20/857 (2025.01) [H10H 20/8506 (2025.01); H10H 20/853 (2025.01); H10H 20/856 (2025.01); H01L 2224/48091 (2013.01); H01L 2224/48095 (2013.01); H10H 20/8512 (2025.01)] 4 Claims
OG exemplary drawing
 
1. A light emitting device comprising:
a base member comprising:
a first lead,
a second lead, and
a resin member supporting the first lead and the second lead,
wherein each of a surface of the first lead, a surface of the second lead, and a surface of the resin member are positioned at an upper surface of the base member;
one or more light emitting elements located at the surface of the first lead that forms a portion of the upper surface of the base member;
a resin frame located at the upper surface of the base member so as to surround one or more light emitting elements, wherein, in a top view, the resin frame is substantially quadrangular, and an inner peripheral lower edge of the resin frame is substantially quadrangular;
a Zener diode disposed on the surface of the second lead that forms a portion of the upper surface of the base member, the Zener diode being embedded in a corner portion of the resin frame; and
a wire connecting the Zener diode and the first lead, wherein a first end portion of the wire that is connected to the Zener diode is embedded in the resin frame, and a second end portion of the wire that is connected to the first lead is exposed from the resin frame; wherein:
the surface of the first lead includes a first surface that is exposed inward of the resin frame,
the surface of the resin member includes a second surface that is exposed inward of the resin frame
four peripheral portions of the first surface are positioned inward of and apart from four corner portions of the inner peripheral lower edge of the resin frame,
the second surface has four exposed surface portions that are exposed between the four corner portions of the inner peripheral lower edge and the four peripheral portions of the first surface, and
the light emitting device further comprises four separate reflecting members covering the four exposed surface portions at locations spaced from the one or more light emitting elements, each of the four separate reflecting members having a thickness that gradually increases toward the resin frame, and
an inclination angle of a surface of each of the four separate reflecting members relative to the second surface at an inner end of the reflecting member apart from the resin frame is smaller than an internal angle of the resin frame at an inner end of the resin frame.