US 12,471,413 B2
LED module, LED display module and method of manufacturing the same
Ruth Boss, Neutraubling (DE); Sebastian Wittmann, Regenstauf (DE); Korbinian Perzlmaier, Regensburg (DE); and Frank Singer, Regenstauf (DE)
Assigned to OSRAM Opto Semiconductors GmbH, Regensburg (DE)
Appl. No. 17/605,533
Filed by OSRAM Opto Semiconductors GmbH, Regensburg (DE)
PCT Filed Mar. 24, 2020, PCT No. PCT/EP2020/058124
§ 371(c)(1), (2) Date Oct. 21, 2021,
PCT Pub. No. WO2020/216549, PCT Pub. Date Oct. 29, 2020.
Claims priority of application No. 10 2019 110 500.5 (DE), filed on Apr. 23, 2019; application No. 10 2019 125 875.8 (DE), filed on Sep. 25, 2019; and application No. PCT/EP2020/052191 (WO), filed on Jan. 29, 2020.
Prior Publication US 2022/0231193 A1, Jul. 21, 2022
Int. Cl. H01L 33/24 (2010.01); A61B 5/00 (2006.01); H01L 25/075 (2006.01); H01L 25/16 (2023.01); H01L 33/00 (2010.01); H10H 20/01 (2025.01); H10H 20/812 (2025.01); H10H 20/821 (2025.01); H10H 20/84 (2025.01); H10H 20/857 (2025.01)
CPC H10H 20/821 (2025.01) [A61B 5/6898 (2013.01); H01L 25/0753 (2013.01); H01L 25/167 (2013.01); H10H 20/018 (2025.01); H10H 20/812 (2025.01); H10H 20/84 (2025.01); H10H 20/857 (2025.01); H10H 20/034 (2025.01); H10H 20/0364 (2025.01)] 31 Claims
OG exemplary drawing
 
1. A method of manufacturing modules of LEDs, comprising:
producing at least one layer stack providing a base module on a carrier comprising a first layer, an active layer formed thereon, and a second layer formed thereon;
exposing of a surface area of the first layer facing away from the carrier;
forming a first contact to a surface region of the second layer facing away from the carrier;
forming a second contact to the surface area of the first layer facing away from the carrier;
forming at least one LED module from the base module by means of deep mesa structuring through the first layer, in particular from a side of the second layer; and
generating quantum well intermixing in regions of the active layer that extend adjacent to the deep mesa structuring.