US 12,471,406 B2
Conductive silver paste for sintering by LECO technology, preparation method, electrode, and battery
Jie Liu, Shanghai (CN); Mingfei Shu, Shanghai (CN); Xiaolong Chen, Shanghai (CN); and Liang Wang, Shanghai (CN)
Assigned to SHANGHAI SILVER PASTESCI. & TECH. CO., LTD., Shanghai (CN)
Filed by SHANGHAI SILVER PASTE SCI. & TECH. CO., LTD., Shanghai (CN)
Filed on Apr. 23, 2024, as Appl. No. 18/644,051.
Claims priority of application No. 202311533362.2 (CN), filed on Nov. 17, 2023.
Prior Publication US 2025/0169223 A1, May 22, 2025
Int. Cl. H10F 77/20 (2025.01)
CPC H10F 77/211 (2025.01) 5 Claims
 
1. A conductive silver paste for sintering by LECO technology, wherein the conductive silver paste comprises silver powder, glass powder, organic carrier, and inorganic additive;
in weight percentage, the weight percentage contents of these components are: silver powder 84.0%-92.0%, glass powder 0.5%-3.0%; organic carrier 6.5%-13.5%; inorganic additive 0.2%-1.0%;
wherein the glass powder comprises main glass powder, the main glass powder is glass powder containing Pb, O, and first main element, second main element, and third main element systems; the first main element comprises at least Si, the second main element comprises at least B, the third main element comprises at least Ag, and the main glass powder is glass powder in a Pb—Si—B—O—Ag structure system;
the first main element further comprises Ge, the second main element further comprises Al or Ga, and the third main element further comprises Li, Na, or K;
in the main glass powder, in mole percentage, the mole percentages corresponding to components are as follows: PbO 20.0%-45.0%; the sum of SiO2 and GeO2 5.0%-50.0%; the sum of B2O3, Al2O3, and Ga2O3 5.0%-30.0%; the sum of Ag2O, Li2O, Na2O, and K2O 1.0%-25.0%; first modified additive 5.8%-25.0%;
wherein the first modified additive comprises one or more of oxides of Mg, Ca, Ba, Sn, Bi, and Se, and compounds that can decompose to obtain the oxides during a process of manufacturing the main glass powder;
the inorganic additive comprises silver composite additive and auxiliary additive;
the silver composite additive is one or more of silver oxide, silver silicate, silver borate, and silver selenate, and the auxiliary additive is one or more of aluminum powder, lead powder, zinc powder, silicon magnesium alloy powder, boron powder, silicon powder, silicon boride powder, silicon nitride, boron nitride, aluminum boride, zinc oxide powder, bismuth oxide powder, and silicon dioxide powder.