US 12,471,397 B2
Imaging element and imaging device
Kouichi Inoue, Kumamoto (JP)
Assigned to SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
Appl. No. 17/776,020
Filed by SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
PCT Filed Sep. 30, 2020, PCT No. PCT/JP2020/037267
§ 371(c)(1), (2) Date May 11, 2022,
PCT Pub. No. WO2021/100330, PCT Pub. Date May 27, 2021.
Claims priority of application No. 2019-209191 (JP), filed on Nov. 19, 2019.
Prior Publication US 2022/0392939 A1, Dec. 8, 2022
Int. Cl. H10F 39/00 (2025.01); H10F 39/18 (2025.01)
CPC H10F 39/806 (2025.01) [H10F 39/024 (2025.01); H10F 39/182 (2025.01); H10F 39/8053 (2025.01); H10F 39/8063 (2025.01); H10F 39/807 (2025.01)] 18 Claims
OG exemplary drawing
 
1. An imaging element, comprising:
a plurality of pixels, wherein each pixel of the plurality of pixels includes:
a semiconductor substrate, wherein
the semiconductor substrate includes a front surface side and a back surface side, and
the front surface side is opposite to the back surface side;
a plurality of wiring layers on the front surface side of the semiconductor substrate;
an interlayer film, wherein
the interlayer film includes a first surface side and a second surface side, and
the second surface side of the interlayer film is on the back surface side of the semiconductor substrate;
a plurality of color filters, wherein
the plurality of color filters includes a first color filter and a second color filter, and
the first color filter and the second color filter are on the first surface side of the interlayer film;
a recess in the interlayer film at a boundary of the plurality of pixels;
a light guide wall bottom film on the recess; and
a light guide wall between the first color filter and the second color filter, wherein
the light guide wall bottom film is between the light guide wall and the recess.