US 12,471,392 B2
Semiconductor detector and method of manufacturing same
Kazuyuki Hozawa, Tokyo (JP); and Takashi Takahama, Tokyo (JP)
Assigned to HITACHI HIGH-TECH ANALYSIS CORPORATION, Tokyo (JP)
Filed by HITACHI HIGH-TECH ANALYSIS CORPORATION, Tokyo (JP)
Filed on Jan. 6, 2023, as Appl. No. 18/094,131.
Claims priority of application No. 2022-037744 (JP), filed on Mar. 11, 2022.
Prior Publication US 2023/0290896 A1, Sep. 14, 2023
Int. Cl. H10F 30/295 (2025.01); H10F 71/00 (2025.01); H10F 77/1223 (2025.01); H10F 77/20 (2025.01)
CPC H10F 30/2955 (2025.01) [H10F 71/121 (2025.01); H10F 77/1223 (2025.01); H10F 77/206 (2025.01)] 4 Claims
OG exemplary drawing
 
1. A semiconductor detector comprising:
an n-type semiconductor substrate;
a detection electrode formed on a first surface of the n-type semiconductor substrate and configured to collect charges generated by incidence of radiation;
a plurality of drift electrodes formed surrounding the detection electrode and applied with a voltage causing a potential gradient in which a potential changes toward the detection electrode so that the charges move toward the detection electrode; and
a radiation incidence window provided on a second surface of the n-type semiconductor substrate;
a P-type semiconductor region formed by adding boron to a surface side of the second surface through the radiation incidence window; and
a depleting electrode causing a reverse bias between the P-type semiconductor region formed on the second surface and an N-type semiconductor region formed in the n-type semiconductor substrate,
wherein fluorine is additionally added to the P-type semiconductor region, and
wherein a region with the highest concentration of fluorine is positioned more closely to the surface side of the second surface than a region with the highest concentration of boron.