US 12,471,381 B2
Rectifier device with minimized lateral coupling
Benedikt Kindl, Wackersdorf (DE); Juliane Laurer, Regensburg (DE); Max Stelzer, Regensburg (DE); and Vadim Valentinovic Vendt, Munich (DE)
Assigned to Infineon Technologies AG, Neubiberg (DE)
Filed by Infineon Technologies AG, Neubiberg (DE)
Filed on Sep. 9, 2022, as Appl. No. 17/941,901.
Prior Publication US 2024/0088130 A1, Mar. 14, 2024
Int. Cl. H10D 89/60 (2025.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01)
CPC H10D 89/60 (2025.01) [H01L 23/528 (2013.01); H01L 23/5226 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
a semiconductor body comprising an upper surface;
a group of first lower-level conductive fingers and second lower-level conductive fingers that are disposed on or above the upper surface and are arranged alternatingly with one another in a first lateral direction and; and
a group of first upper-level metal fingers and second upper-level metal fingers that are arranged alternatingly with one another in the first lateral direction,
wherein each of the first upper-level metal fingers is electrically connected to the semiconductor body by first vertical connectors that comprise one of the first lower-level conductive fingers,
wherein each of the second upper-level metal fingers is electrically connected to the semiconductor body by second vertical connectors that comprise one of the second lower-level conductive fingers,
wherein the group of first lower-level conductive fingers and second lower-level conductive fingers defines a connection area over the upper surface, and
wherein in the connection area the first upper-level metal fingers are completely non-overlapping with the second upper-level metal fingers in the first lateral direction.