| CPC H10D 86/60 (2025.01) [H01L 25/0753 (2013.01); H01L 25/167 (2013.01); H10D 86/443 (2025.01); H10H 20/857 (2025.01); H10H 20/0364 (2025.01)] | 18 Claims |

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1. An array substrate, comprising:
a substrate;
a first conductive layer, provided on a side of the substrate;
a second conductive layer, provided on a side of the first conductive layer away from the substrate, wherein an orthographic projection of the second conductive layer on the substrate has an overlapped region with an orthographic projection of the first conductive layer on the substrate, and the overlapped region comprises a via region and a routing region; and
at least two organic insulating layers, provided between the first conductive layer and the second conductive layer, and an orthographic projection of the at least two organic insulating layers on the substrate is overlapped with an orthographic projection of the routing region;
wherein the first conductive layer comprises a plurality of conductive portions, the second conductive layer comprises a plurality of pads, and an orthographic projection of at least a part of the pads on the substrate is not overlapped with an orthographic projection of the conductive portions on the substrate.
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