US 12,471,333 B2
Electronic device
Chen-Lin Yeh, Miao-Li County (TW); Chin-Lung Ting, Miao-Li County (TW); Chung-Kuang Wei, Miao-Li County (TW); Jen-Hai Chi, Miao-Li County (TW); Yi-Hung Lin, Miao-Li County (TW); and Yan-Zheng Wu, Miao-Li County (TW)
Assigned to Innolux Corporation, Miao-Li County (TW)
Filed by Innolux Corporation, Miao-Li County (TW)
Filed on Dec. 24, 2021, as Appl. No. 17/561,716.
Claims priority of provisional application 63/134,186, filed on Jan. 6, 2021.
Claims priority of application No. 202111284065.X (CN), filed on Nov. 1, 2021.
Prior Publication US 2022/0216302 A1, Jul. 7, 2022
Int. Cl. H10D 62/13 (2025.01); H05K 1/11 (2006.01); H05K 3/34 (2006.01)
CPC H10D 62/13 (2025.01) [H05K 1/111 (2013.01); H05K 3/3457 (2013.01)] 7 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
a substrate;
a first electrode disposed on the substrate;
a second electrode disposed on the substrate;
a modulation element disposed on the substrate and comprising at least two connecting pads;
a first solder disposed between the first electrode and one of the at least two connecting pads of the modulation element;
a protection layer covering the modulation element and wrapping the at least two connecting pads of the modulation element and the first solder, wherein a part of the protective layer is disposed between the modulation element and the substrate; and
a switch element disposed on the substrate,
wherein the one of the at least two connecting pads of the modulation element is electrically connected to the switch element sequentially through the first solder, the first electrode, and the second electrode,
wherein in a thickness direction of the electronic device, the first electrode is disposed between the substrate and the second electrode, and the second electrode is disposed between the first electrode and the switch element.