| CPC H10D 1/684 (2025.01) [H01L 21/02601 (2013.01); H10B 51/30 (2023.02); H10B 53/30 (2023.02); H10D 1/692 (2025.01); H10D 30/024 (2025.01); H10D 30/031 (2025.01); H10D 30/0415 (2025.01); H10D 30/6211 (2025.01); H10D 30/6757 (2025.01); H10D 30/701 (2025.01); H10D 64/033 (2025.01); H10D 64/689 (2025.01); H10D 30/62 (2025.01)] | 20 Claims |

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1. A ferroelectric fin field-effect transistor (FinFET) comprising:
a semiconductor substrate having a first surface;
a semiconductor fin extending in a vertical direction from the first surface of the semiconductor substrate, the semiconductor fin comprising a source region, a drain region, and a channel region disposed between the source region and the drain region;
seed metal particles disposed on multiple surfaces of the channel region;
a ferroelectric (FE) layer disposed on the seed metal particles and directly contacting portions of the channel region exposed through the seed metal particles; and
a gate electrode layer disposed on the FE layer,
wherein the seed metal particles have an average particle size ranging from about 1 angstrom to about 10 angstroms.
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