US 12,471,261 B2
Heat dissipation device for display, and manufacturing method therefor
Yong-Duck Lee, Anyang-si (KR)
Assigned to TAEIN LEADING THERMAL SOLUTIONS CO., LTD., Gunpo-si (KR)
Appl. No. 18/548,097
Filed by TAEIN LEADING THERMAL SOLUTIONS CO., LTD., Gunpo-si (KR)
PCT Filed Jan. 17, 2022, PCT No. PCT/KR2022/000853
§ 371(c)(1), (2) Date Aug. 27, 2023,
PCT Pub. No. WO2022/211237, PCT Pub. Date Oct. 6, 2022.
Claims priority of application No. 10-2021-0043387 (KR), filed on Apr. 2, 2021.
Prior Publication US 2024/0155819 A1, May 9, 2024
Int. Cl. H05K 7/20 (2006.01); H05K 9/00 (2006.01)
CPC H05K 7/20963 (2013.01) [H05K 7/20509 (2013.01); H05K 9/0015 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A heat dissipation device for a display, the heat dissipation device comprising a flat panel heatsink unit comprising a central processing unit (CPU) contacting part, a push pin coupling part, and an EMI gasket contacting part, and a heat dissipation plate connected to and installed at the heatsink unit,
wherein the EMI gasket contacting part has a first inserting groove into which an upper end of an EMI gasket is inserted.