US 12,471,253 B2
Heat dissipation structure and electronic device
Hao-Wei Chan, Taipei (TW)
Assigned to GETAC TECHNOLOGY CORPORATION, New Taipei (TW)
Filed by Getac Technology Corporation, New Taipei (TW)
Filed on Aug. 10, 2022, as Appl. No. 17/884,632.
Prior Publication US 2024/0057295 A1, Feb. 15, 2024
Int. Cl. H05K 7/20 (2006.01); G06F 1/20 (2006.01)
CPC H05K 7/20481 (2013.01) [G06F 1/203 (2013.01)] 20 Claims
OG exemplary drawing
 
10. An electronic device, comprising:
a housing, comprising a wall surface, the wall surface comprising an accommodating groove, a supporting surface and an inclined surface, the accommodating groove recessed on the supporting surface, and the inclined surface connected to the supporting surface and located on one side of the accommodating groove;
a heat conduction sheet, accommodated in the accommodating groove, wherein a surface of the heat conduction sheet is in aligned with a surface of the supporting surface;
a thin film, covering the supporting surface, the heat conduction sheet and the inclined surface; and
a pluggable heat source, arranged on the thin film;
wherein the wall surface further comprises an extension surface connected to the inclined surface, and a slope of the extension surface is more than a slope of the inclined surface.