US 12,471,252 B2
Heat dissipation device with communication function
Ta-Chun Pu, Taoyuan (TW); and Chun-Yih Wu, Taoyuan (TW)
Assigned to HTC Corporation, Taoyuan (TW)
Filed by HTC Corporation, Taoyuan (TW)
Filed on Aug. 16, 2023, as Appl. No. 18/450,631.
Application 18/450,631 is a continuation of application No. 17/206,711, filed on Mar. 19, 2021, granted, now 11,778,784.
Prior Publication US 2023/0397371 A1, Dec. 7, 2023
Int. Cl. H05K 7/20 (2006.01); H01Q 1/27 (2006.01); H01Q 1/36 (2006.01); H01Q 1/44 (2006.01); H01Q 5/307 (2015.01)
CPC H05K 7/2039 (2013.01) [H01Q 1/273 (2013.01); H01Q 1/36 (2013.01); H01Q 1/44 (2013.01); H01Q 5/307 (2015.01)] 32 Claims
OG exemplary drawing
 
1. A heat dissipation device with a communication function, comprising:
a conductive substrate;
a first conductive sidewall;
a plurality of heat sink elements, wherein the first conductive sidewall and the heat sink elements are respectively coupled to the conductive substrate; and
a feeding element, coupled to a signal source, wherein an antenna structure is formed by the feeding element, the conductive substrate, and at least one of the heat sink elements;
wherein a resonant path of the antenna structure is formed by the at least one of the heat sink elements;
wherein the feeding element is configured to excite the heat sink elements for radiation.