US 12,471,243 B2
Thermal dissipation device and control method thereof
Jyun-Miao Hong, Taipei (TW); Jhih-Wei Rao, Taipei (TW); Zih-Siang Huang, Taipei (TW); Chieh Li, Taipei (TW); Chen-Yu Hsu, Taipei (TW); Chih-Hsien Yang, Taipei (TW); Hung-Chieh Wu, Taipei (TW); and Liang-Jen Lin, Taipei (TW)
Assigned to ASUSTEK COMPUTER INC., Taipei (TW)
Filed by ASUSTEK COMPUTER INC., Taipei (TW)
Filed on Jan. 20, 2023, as Appl. No. 18/157,692.
Claims priority of application No. 111124322 (TW), filed on Jun. 29, 2022.
Prior Publication US 2024/0008217 A1, Jan. 4, 2024
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/20209 (2013.01) [H05K 7/20136 (2013.01); H05K 7/20481 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A thermal dissipation device, for a handheld electronic device, wherein the handheld electronic device has a heating surface, and the heating surface has a heating surface temperature, the thermal dissipation device comprising:
a thermoelectric cooling chip, having a cold surface and a hot surface, wherein the cold surface is attached on the heating surface by means of a heat conduction structure, and has a cold surface temperature;
a temperature sensor, disposed in an area adjacent to the thermoelectric cooling chip, and configured to generate an environmental temperature;
a humidity sensor, disposed in the adjacent area, and configured to generate an environmental humidity; and
a processing unit, electrically connected to the thermoelectric cooling chip, the temperature sensor, and the humidity sensor, and configured to:
calculate a dew point temperature based on the environmental temperature and the environmental humidity; and
determine whether to stop the thermoelectric cooling chip or not based on the cold surface temperature, the dew point temperature, and the heating surface temperature,
wherein the processing unit is configured to calculate a first heat value corresponding to the thermoelectric cooling chip based on the cold surface temperature and the dew point temperature, and a second heat value corresponding to the heating surface based on the heating surface temperature and the dew point temperature, and to stop the thermoelectric cooling chip when the first heat value is less than the second heat value.