US 12,471,233 B2
System and method for a frameless modular electronic device
Wenqian Hu, Addison, TX (US); Han Su, Ann Arbor, MI (US); and Jian Li, Waltham, MA (US)
Assigned to FutureWei Technologies, Inc., Addison, TX (US)
Filed by Huawei Technologies Co., Ltd., Shenzhen (CN)
Filed on Aug. 29, 2023, as Appl. No. 18/457,723.
Application 18/457,723 is a continuation of application No. PCT/US2021/020484, filed on Mar. 2, 2021.
Prior Publication US 2023/0403802 A1, Dec. 14, 2023
Int. Cl. H05K 5/30 (2025.01); G06F 1/16 (2006.01); H04M 1/02 (2006.01); H05K 5/02 (2006.01)
CPC H05K 5/30 (2025.01) [G06F 1/1624 (2013.01); G06F 1/1658 (2013.01); H04M 1/0254 (2013.01); H05K 5/0256 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A frameless modular multi-functional electronic device, comprising:
a base module comprising a processor, the base module having a first length and a first width;
a plurality of component modules, at least one of which is configured to connect directly in contact with the base module, at least one of the component modules having a different size or shape than the base module such that at least one of the component modules has a second length and a second width, each of the component modules and the base module comprising
a connecting member configured to slidably align and mate the component modules together;
an electrical interface configured to transmit digital information and energy between connected base and component modules; and
the component modules configured to be interchangeably connected directly in contact with each other and the base module, wherein when assembled, the base module and the plurality of component modules when connected form the frameless modular multi-functional electronic device with a length equal to the first length plus at least the second length, and a width equal to the first width plus the second width.