| CPC H05K 1/181 (2013.01) [H01F 27/24 (2013.01); H01F 27/28 (2013.01); H05K 1/111 (2013.01); H05K 1/14 (2013.01); H05K 2201/1003 (2013.01)] | 5 Claims |

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1. A sandwich structure power supply module, comprising:
an inductor pack having a magnetic core and at least one inductor having at least one winding;
a top PCB (Printed Circuit Board) on top of the inductor pack; and
at least one power device chip on top of the top PCB, wherein each one of the at least one power device chip has at least one pin connected to an associated inductor of the inductor pack via the top PCB; wherein
the inductor pack is wrapped with a plurality of metal layers, wherein a first metal layer of the plurality of metal layers is electrically connected to a first potential, a second metal layer of the plurality of metal layers is electrically connected to a second potential, each of the first metal layer and the second metal layer covers a first side surface of the magnetic core with an isolation layer in between, and a first end of the first metal layer is bent and extended along a top surface of the magnetic core to form two tabs, and a first end of the second metal layer is bent and extended along the top surface of the magnetic core between the two tabs.
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