US 12,471,213 B2
Circuit board
Jong Bae Shin, Seoul (KR); Soo Min Lee, Seoul (KR); and Jae Hun Jeong, Seoul (KR)
Assigned to LG INNOTEK CO., LTD., Seoul (KR)
Appl. No. 18/026,917
Filed by LG INNOTEK CO., LTD., Seoul (KR)
PCT Filed Sep. 17, 2021, PCT No. PCT/KR2021/012807
§ 371(c)(1), (2) Date Mar. 17, 2023,
PCT Pub. No. WO2022/060166, PCT Pub. Date Mar. 24, 2022.
Claims priority of application No. 10-2020-0120509 (KR), filed on Sep. 18, 2020.
Prior Publication US 2023/0328886 A1, Oct. 12, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/46 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01)
CPC H05K 1/111 (2013.01) [H05K 1/183 (2013.01); H05K 1/185 (2013.01); H05K 3/4697 (2013.01); H05K 1/0271 (2013.01); H05K 1/0366 (2013.01); H05K 1/186 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A circuit board, comprising:
a first insulating layer;
a second insulating layer disposed on the first insulating layer and including a cavity;
a circuit layer embedded in the second insulating layer; and
an electronic device disposed in the cavity of the second insulating layer; wherein an inner wall surface forming the cavity includes:
a first surface having a first inclination angle with respect to an upper surface of the first insulating layer, a second surface disposed on the first surface and having a second inclination angle different from the first inclination angle with respect to the upper surface of the first insulating layer, and a first contact portion in which the first surface and the second surface contact each other, wherein the circuit layer includes:
a first via electrode overlapping the first surface of the cavity along a horizontal direction, a second via electrode disposed on the first via electrode and overlapping the second surface along the horizontal direction without overlapping the first surface along the horizontal direction, and an upper circuit pattern disposed between the first via electrode and the second via electrode and overlapping the second surface along the horizontal direction without overlapping the first surface along the horizontal direction, wherein the first via electrode and the second via electrode overlaps each other along a vertical direction perpendicular to the horizontal direction, and wherein the electronic device overlaps the first via electrode, the second via electrode, and the upper circuit pattern, and the first contact portion in the horizontal direction.