US 12,471,206 B2
Radio frequency module and communication device
Kunitoshi Hanaoka, Kyoto (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Kyoto (JP)
Filed on Apr. 26, 2023, as Appl. No. 18/307,153.
Application 18/307,153 is a continuation of application No. PCT/JP2021/036128, filed on Sep. 30, 2021.
Claims priority of application No. 2020-207014 (JP), filed on Dec. 14, 2020.
Prior Publication US 2023/0319983 A1, Oct. 5, 2023
Int. Cl. H05K 1/02 (2006.01); H03H 9/13 (2006.01); H03H 9/54 (2006.01)
CPC H05K 1/0243 (2013.01) [H03H 9/13 (2013.01); H03H 9/54 (2013.01); H05K 2201/1006 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A radio frequency module comprising:
a mounting substrate including a first main surface and a second main surface that are opposed to each other in a thickness direction;
a first electronic component and a second electronic component that are mounted on the first main surface of the mounting substrate;
a piece of metal between the first electronic component and the second electronic component on the first main surface of the mounting substrate;
a first metal layer on the first main surface of the mounting surface;
a resin layer on the first main surface of the mounting surface;
a second metal layer covering at least a part of the resin layer; and
an inductor incorporated in the mounting substrate,
wherein the resin layer covers at least a part of the first electronic component, covers at least a part of the second electronic component, covers an outer peripheral surface of the piece of metal, and covers the first metal layer,
wherein the first metal layer is at a ground potential, and is in contact with the second metal layer,
wherein the piece of metal is in contact with the first metal layer and the second metal layer,
wherein the first metal layer overlaps the first electronic component in a plan view from the thickness direction,
wherein the first electronic component is a filter,
wherein the first metal layer is between the filter and the inductor,
wherein the filter comprises:
a piezoelectric substrate including a third main surface and a fourth main surface that are opposed to each other; and
an interdigital transducer (IDT) electrode mounted on the third main surface of the piezoelectric substrate,
wherein the filter is mounted on the first main surface of the mounting substrate, and
wherein the third main surface of the piezoelectric substrate is on the first main surface side of the mounting substrate.