US 12,471,205 B1
Controlling uniformity of electrical current distribution in device for power delivery to integrated circuit
Liav Ben Artsi, Nahariya (IL); and Ram Ben Ezra, Yokneam Illit (IL)
Assigned to Marvell Asia Pte Ltd, Singapore (SG)
Filed by Marvell Israel (M.I.S.L) Ltd., Yokneam (IL)
Filed on Jul. 12, 2023, as Appl. No. 18/350,775.
Claims priority of provisional application 63/388,273, filed on Jul. 12, 2022.
Int. Cl. H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/40 (2006.01)
CPC H05K 1/0218 (2013.01) [H05K 1/115 (2013.01); H05K 3/4038 (2013.01); H05K 2201/10734 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An electrical circuit board assembly, comprising:
a surface, having a plurality of terminals disposed thereon for transferring a power signal to an electronic device;
at least first and second layers separated by at least one dielectric layer, the first and second layers being configured to (a) be connected to the power signal, and (b) electrically conduct at least a portion of the power signal; and
multiple vias that (i) mechanically traverse the first and second layers at respective traversal points, and (ii) are electrically connected to the terminals on the surface, the multiple vias comprising:
first vias that, at the respective traversal points, are electrically connected to the first layer and electrically isolated from the second layer; and
second vias that, at the respective traversal points, are electrically connected to the second layer and electrically isolated from the first layer, wherein the first vias are arranged in a first region, and the second vias are arranged in a second region, wherein the multiple vias further comprise third vias that, at the respective traversal points, are electrically connected to both the first layer and the second layer, and wherein a first current density difference among the first vias, the second vias and the third vias is less than a first predetermined threshold.