US 12,471,203 B2
Interconnection of printed circuit boards with nanowires
Klaus Haimlinger, Kobenz (AT); Christian Hoelzl, St. Marein-Feistritz (AT); and Marco Gavagnin, Leoben (AT)
Assigned to AT & S Austria Technologie & Systemtechnik AG, Leoben (AT)
Filed by AT & S Austria Technologie & Systemtechnik AG, Leoben (AT)
Filed on Mar. 21, 2023, as Appl. No. 18/124,450.
Claims priority of application No. 22165931 (EP), filed on Mar. 31, 2022.
Prior Publication US 2023/0319976 A1, Oct. 5, 2023
Int. Cl. H05K 3/46 (2006.01); H05K 1/02 (2006.01); H05K 1/14 (2006.01)
CPC H05K 1/0213 (2013.01) [H05K 1/144 (2013.01); H05K 3/46 (2013.01); H05K 2201/026 (2013.01); H05K 2201/0379 (2013.01); H05K 2201/058 (2013.01); H05K 2203/02 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A carrier assembly, wherein the carrier assembly comprises:
a first carrier sub-assembly, said first carrier sub-assembly having an elongated shape and comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure, said at least one electrically conductive layer structure extending from a first extremity to a second extremity of the elongated shape of the first carrier sub-assembly, said at least one electrically conductive layer extending up to a first area provided on one of the first and second extremities of the elongated shape, wherein a first plurality of conductive nanowires is provided on said first area, and
a second carrier sub-assembly, said second carrier sub-assembly comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure, said at least one electrically conductive layer structure comprising a second area, wherein a second plurality of conductive nanowires is provided on that second area,
said first carrier sub-assembly and said second carrier sub-assembly being connected one to each other through a connection of the first plurality of nanowires with the second plurality of nanowires.