US 12,470,799 B2
Electronic device comprising camera module with a multi-layer ceramic condenser (MLCC) disposed in a hole in a metal plate under a rigid printed circuit board (RPCB)
Sewon Kim, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Jan. 5, 2024, as Appl. No. 18/405,268.
Application 18/405,268 is a continuation of application No. PCT/KR2022/008445, filed on Jun. 15, 2022.
Claims priority of application No. 10-2021-0088474 (KR), filed on Jul. 6, 2021.
Prior Publication US 2024/0205530 A1, Jun. 20, 2024
Int. Cl. H04N 5/335 (2011.01); H04N 23/57 (2023.01); H05K 1/18 (2006.01)
CPC H04N 23/57 (2023.01) [H05K 1/183 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10636 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A camera module comprising:
a rigid printed circuit board (RPCB);
a metal plate coupled to a lower surface of the RPCB and having one or more holes formed therein;
a multi-layer ceramic condenser (MLCC) disposed in the one or more holes under the RPCB; and
an image sensor disposed on the metal plate,
wherein a height of the MLCC is less than a height of the metal plate with reference to a lower surface of the RPCB.